Mission Critical Facilities, Data Centers, Technology Spaces and Electronic Equipment
ASHRAE Technical Committee 9.9

Meetings Information

TC 9.9 has identified the following technical programs and meetings at the next ASHRAE Conference that is of interest to the data center community:

Workshop 1: Design Considerations and Challenges on Liquid Cooling Applications of Data Centers

Marriott Marquis Chicago, 2nd Floor, Water Tower B
Summary:
The demand for high performance computing, machine learning, artificial intelligence and edge computing is driving an inflection point in the demand for higher power processor chips with lower temperature requirements. Simultaneously, data center cooling systems need to operate with higher efficiency to meet sustainability goals. These trends are accelerating the need for liquid cooling in the data center.  This seminar focuses on the consultant’s perspective - how to deploy liquid cooling applications both for new data centers and existing data centers.
Chair:
Timothy Shedd, PhD

Seminar 11: Lessons Learned and Engineer Rules on CFD Applications in Data Center Design

– Summary:
Computational fluid dynamics is a widely used tool to design data center applications.  This session brings you a team of experts and provides lessons learned on the CFD applications of Data Center, such as the wind effect modeling, engineering rules, and special challenges in mixed Density / Mixed Cooling Topologies.  
Chair:
Eric Yang, PE

Seminar 14: Advancements in Liquid Cooling Applications for Data Centers

– Location: Marriott Marquis Chicago, Watershed A
Summary:
New computer processor designs are making new applications available every year, but these new processors are also often generating more heat.  To meet the need to cool these processors, many new technologies have been introduced in the marketplace.  This seminar discusses the trend in computer processor power and present the fundamentals of many of the new liquid cooling innovations used to cool them.  In addition, attendees will learn how ASHRAE is aiding in this technology transition through the expansion of (SSPC 127)  to cover data center liquid cooling products.
Chair:
Eric Yang, PE

Seminar 63: LIVESTREAM: Hot Off the Press! ASHRAE TC 9.9 Liquid Cooling Publication

  – Location: Marriott Marquis Chicago, 2nd Floor, Great Lakes A
Summary:
Since its initial publication, Liquid Cooling Guidelines for Datacom Equipment Centers has provided equipment manufacturers and facility operations personnel with a common set of guidelines for various liquid cooling strategies focusing on the requirements for both the Technology Cooling System and Facility Cooling System. In this seminar we will give a preview of the forthcoming 3rd Edition of the publication. We will cover everything from the latest power trends driving the adoption of liquid, the variety of IT server cooling technologies, and the considerations when designing a facility for liquid cooling.
Chair:
Eric Yang, PE

Presentation 1: What’s Driving the Interest in Liquid Cooling?

  – Presenting Author: Roger Schmidt, PhD, IBM/Syracuse U.
This session will provide some historical context on the ASHRAE TC 9.9 publication Liquid Cooling Guidelines for Datacom Equipment Centers and how over time, liquid cooling will go from a niche part of the data center industry, to necessary for meeting the IT component power trends to support the next generation of IT workloads.
Learning Objectives:
• Explain the current trends in IT processor chips that are driving the need for liquid cooling.
• Describe the types of liquid cooling solutions used for cooling IT equipment.

Presentation 2: The Technology Cooling System (TCS) Loop and Its Technology Solutions

  – Presenting Author: Tim Shedd, PhD, Dell, Tampa, FL, USA
There are a number of solutions today support liquid cooling in the data center. This session will detail the design characteristics of conductive cold plate cooling and immersion cooling systems. It will also discuss guidance to link the Facility Water System (FWS) environmental classes to the TCS to ensure both the facility and the datacom equipment are properly designed to support energy efficiency.

Presentation 3: The Facility Water System (FWS) and Considerations for Delivering Liquid Cooling

  – Presenting Author: Dustin Demetriou, PhD, IBM, Hyde Park, NY, USA
There will remain a need for data centers to support both air and liquid cooling of IT equipment. This session will detail the key design considerations for deploying an FWS loop and how they are different than the considerations for the TCS loop. It will also provide design guidance for air cooled facilities that are being upgraded to support liquid cooled datacom equipment.
TC 9.9 sponsored seminars, conference paper session, data center related topics, etc. will be posted for each conference in the Meetings section of this website.

 

 

Attend a Committee Meeting

ALL ASHRAE committee meetings, including this TC’s meetings at the Winter and Annual Society conferences, are open to the public at no cost nor is conference registration required. Interested visitors, local chapter members, and potential new TC members are always welcome. However to attend technical program sessions sponsored by the TC will require registration and payment of any applicable fee.

Participation in an ASHRAE TC provides the opportunity to grow professionally and to contribute to the advancement of HVAC&R within an international organization recognized for shaping the future of the built environment through research, standards writing, publishing, and education.